Intern - Thermal Modeling & Simulation

Research and develop thermal modeling techniques coordinated with simulation tools improved by artificial intelligence. Analyze thermal heat transfer challenges in advanced high-performance memory packaging. Propose design or process modifications to reduce thermal hotspots and improve reliability. Collaborate with multi-functional teams to validate solutions and implement improvements. Document findings and contribute to knowledge sharing within the engineering organization. Currently pursuing a Master's or Ph.D. in Mechanical Engineering, Electrical Engineering, Computer Science, or related field. Strong understanding of heat transfer principles and thermal analysis. Proficiency in Python or similar programming languages for simulation and modeling. Familiarity with AI/ML concepts and their application in engineering simulations. Excellent analytical, problem-solving, and communication skills. Experience with thermal simulation tools (e.g., ANSYS, COMSOL, or similar). Knowledge of semiconductor packaging and advanced memory technologies. Hands-on experience applying AI/ML to engineering problems. Ability to work independently and deliver innovative solutions in a research environment.